Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159868 | Semiconductor structure and method for forming same | Ma Lisha | 2024-12-03 |
| 12068233 | Adapter board and method for forming same, packaging method, and package structure | Yang Lie Yong, Chen Wei, Lu Xiao Yu | 2024-08-20 |