HM

Hing Jii Mea

📍 Pittsburgh, PA: #368 of 1,235 inventorsTop 30%
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1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12027442 Thermal interface material, an integrated circuit formed therewith, and a method of application thereof Jeffrey D. Gelorme, Navid Kazem, Keyton D. Feller, Dylan S. Shah, Allyssa Kerr +1 more 2024-07-02