Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027442 | Thermal interface material, an integrated circuit formed therewith, and a method of application thereof | Navid Kazem, Keyton D. Feller, Hing Jii Mea, Dylan S. Shah, Allyssa Kerr +1 more | 2024-07-02 |