Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183665 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Kyung Don Mun | 2024-12-31 |
| 12159826 | Semiconductor package and method of manufacturing the semiconductor package | Myungsam Kang, Jeongseok Kim, Kyungdon Mun | 2024-12-03 |
| 12119305 | Semiconductor package | Kyungdon Mun, Myungsam Kang, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2024-10-15 |
| 12094817 | Semiconductor package | Myungsam Kang, Kyungdon Mun | 2024-09-17 |
| 12046562 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2024-07-23 |
| 12040297 | Methods of manufacturing semiconductor packages | Myungsam Kang, Jeongseok Kim, Kyungdon Mun | 2024-07-16 |
| 12021020 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Bongju Cho | 2024-06-25 |
| 12002798 | Fan-out type semiconductor package and method of manufacturing the same | Myungsam Kang, Yongjin Park | 2024-06-04 |
| 11935847 | Semiconductor package | Myungsam Kang, Changbae Lee, Bongju Cho, Younggwan Ko, Yongkoon Lee +1 more | 2024-03-19 |
| 11916002 | Semiconductor package | Myungsam Kang, Jeongseok Kim, Kyung Don Mun | 2024-02-27 |