Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183702 | Electronic package with varying interconnects | Kamal K. Sikka, Charles L. Arvin, Thomas E. Lombardi, Piyas Bal Chowdhury, Alfred Grill | 2024-12-31 |
| 12119335 | Interconnection structures for high bandwidth data transfer | Joshua M. Rubin, Arvind Kumar, Mounir Meghelli | 2024-10-15 |