Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183702 | Electronic package with varying interconnects | Charles L. Arvin, Thomas E. Lombardi, Piyas Bal Chowdhury, Alfred Grill, Steven L. Wright | 2024-12-31 |
| 11887908 | Electronic package structure with offset stacked chips and top and bottom side cooling lid | Katsuyuki Sakuma, Hilton T. Toy, Shidong Li, Ravi K. Bonam | 2024-01-30 |