HT

Hilton T. Toy

IBM: 1 patents #1,883 of 5,109Top 40%
📍 Hopewell Junction, NY: #16 of 49 inventorsTop 35%
🗺 New York: #4,046 of 12,119 inventorsTop 35%
Overall (2024): #442,978 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11887908 Electronic package structure with offset stacked chips and top and bottom side cooling lid Kamal K. Sikka, Katsuyuki Sakuma, Shidong Li, Ravi K. Bonam 2024-01-30