Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12137558 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao +6 more | 2024-11-05 |
| 12010838 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao +6 more | 2024-06-11 |
| 11996322 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Jifeng Zhu | 2024-05-28 |
| 11876049 | Bonding alignment marks at bonding interface | Meng Yan, Jia Wen Wang, Shun Hu | 2024-01-16 |