Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185544 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | John D. Hopkins, Jordan D. Greenlee | 2024-12-31 |
| 12156406 | Methods of forming integrated assemblies with improved charge migration impedance | Byeung Chul Kim | 2024-11-26 |
| 12150303 | Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies | Byeung Chul Kim, Francois H. Fabreguette, Richard J. Hill, Purnima Narayanan | 2024-11-19 |
| 12082416 | Integrated assemblies and methods of forming integrated assemblies | Byeung Chul Kim, Davide Resnati, Gianpietro Carnevale | 2024-09-03 |
| 12057400 | Integrated assemblies and methods of forming integrated assemblies | — | 2024-08-06 |
| 12052862 | Microelectronic devices including stack structures having air gaps, and related memory devices, electronic systems, and methods | Byeung Chul Kim | 2024-07-30 |
| 12041779 | Integrated assemblies and methods of forming integrated assemblies | Kunal Shrotri, Matthew Thorum | 2024-07-16 |
| 11871572 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | Davide Resnati, Paolo Tessariol, Richard J. Hill, John D. Hopkins | 2024-01-09 |