Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170261 | Molded direct contact interconnect structure without capture pads and method for the same | Timothy L. Olson, Craig Bishop, Clifford Sandstrom, Paul R. Hoffman | 2024-12-17 |
| 12062550 | Molded direct contact interconnect substrate and methods of making same | Timothy L. Olson, Paul R. Hoffman | 2024-08-13 |
| 12057373 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same | Timothy L. Olson, Clifford Sandstrom, Craig Bishop | 2024-08-06 |
| 11973051 | Molded direct contact interconnect structure without capture pads and method for the same | Timothy L. Olson, Craig Bishop, Clifford Sandstrom, Paul R. Hoffman | 2024-04-30 |