Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170261 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Timothy L. Olson, Craig Bishop, Clifford Sandstrom | 2024-12-17 |
| 12062550 | Molded direct contact interconnect substrate and methods of making same | Robin Davis, Timothy L. Olson | 2024-08-13 |
| 11973051 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Timothy L. Olson, Craig Bishop, Clifford Sandstrom | 2024-04-30 |