Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12061939 | Chip-to-chip interconnect with a layered communication architecture | Pankaj Kansal, Arvind Srinivasan, Harikrishna Madadi Reddy | 2024-08-13 |
NH
Naader Hasani
Overall (2024): #331,413 of 561,600Top 60%
1
Patents 2024