Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12061939 | Chip-to-chip interconnect with a layered communication architecture | Arvind Srinivasan, Harikrishna Madadi Reddy, Naader Hasani | 2024-08-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12061939 | Chip-to-chip interconnect with a layered communication architecture | Arvind Srinivasan, Harikrishna Madadi Reddy, Naader Hasani | 2024-08-13 |