Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087681 | Packaged integrated device with memory buffer integrated circuit die and memory devices on module substrate | Shahram Nikoukary, Jonghyun Cho, Nitin Juneja | 2024-09-10 |
| 11990177 | Multi-die memory device | Scott C. Best | 2024-05-21 |