Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087681 | Packaged integrated device with memory buffer integrated circuit die and memory devices on module substrate | Jonghyun Cho, Nitin Juneja, Ming Li | 2024-09-10 |
| 12027197 | Signal skew in source-synchronous system | Jonghyun Cho, Anand Jai, Pradeep Batra, Lei Luo | 2024-07-02 |