Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12035466 | Systems and methods for manufacturing thin substrate | Meng Chi Lee, Nima Shahidi, Hao Shi, Quan Qi | 2024-07-09 |
| 11956898 | Three-dimensional (3D) copper in printed circuit boards | Anne M. Mason, Chad O. Simpson, William Hannon | 2024-04-09 |