Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12135592 | Printed circuits with embedded resistive thermal devices | — | 2024-11-05 |
| 11971760 | Printed circuits with embedded resistive thermal devices | — | 2024-04-30 |
| 11956898 | Three-dimensional (3D) copper in printed circuit boards | Chad O. Simpson, William Hannon, Mark J. Beesley | 2024-04-09 |