Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183595 | Selective underfill assembly and method therefor | Peter Joseph Hubert Drummen | 2024-12-31 |
| 11963291 | Efficient wave guide transition between package and PCB using solder wall | Michael B. Vincent | 2024-04-16 |