Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009317 | Semiconductor package structure and method for manufacturing the same | You-Lung Yen, Bernd Karl Appelt | 2024-06-11 |
| 11881448 | Semiconductor package structure having substrate with embedded electronic component and conductive pillars | You-Lung Yen, Bernd Karl Appelt | 2024-01-23 |