Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009317 | Semiconductor package structure and method for manufacturing the same | You-Lung Yen, Kay Stefan Essig | 2024-06-11 |
| 12002729 | Electronic package and method of manufacturing the same | You-Lung Yen | 2024-06-04 |
| 12002743 | Electronic carrier and method of manufacturing the same | You-Lung Yen | 2024-06-04 |
| 11961831 | Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure | You-Lung Yen | 2024-04-16 |
| 11881448 | Semiconductor package structure having substrate with embedded electronic component and conductive pillars | You-Lung Yen, Kay Stefan Essig | 2024-01-23 |