Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009317 | Semiconductor package structure and method for manufacturing the same | You-Lung Yen, Bernd Karl Appelt | 2024-06-11 |
| 11881448 | Semiconductor package structure having substrate with embedded electronic component and conductive pillars | You-Lung Yen, Bernd Karl Appelt | 2024-01-23 |