Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040287 | Semiconductor device package and method for manufacturing the same | Chih-Cheng Lee | 2024-07-16 |
| 11997798 | Package substrate and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Min-Yao CHEN | 2024-05-28 |