Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11997798 | Package substrate and method for manufacturing the same | Hsing Kuo Tien, Chih-Cheng Lee, Min-Yao CHEN | 2024-05-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11997798 | Package substrate and method for manufacturing the same | Hsing Kuo Tien, Chih-Cheng Lee, Min-Yao CHEN | 2024-05-28 |