Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062626 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Byungmoon Bae, Junggeun Shin, Hyunsu Sim, Junho Yoon +1 more | 2024-08-13 |
| 12015005 | Semiconductor package including non-conductive film and method for forming the same | Yeongbeom Ko, Wooju Kim, Jungseok Ryu, Haemin Park | 2024-06-18 |