Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062626 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Heejae Nam, Byungmoon Bae, Junggeun Shin, Hyunsu Sim +1 more | 2024-08-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062626 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Heejae Nam, Byungmoon Bae, Junggeun Shin, Hyunsu Sim +1 more | 2024-08-13 |