Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062596 | Semiconductor die with stepped side surface | Rongwei Zhang, Bob Lee | 2024-08-13 |
| 11882660 | Embedded component package structure and manufacturing method thereof | Chien-Fan Chen | 2024-01-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062596 | Semiconductor die with stepped side surface | Rongwei Zhang, Bob Lee | 2024-08-13 |
| 11882660 | Embedded component package structure and manufacturing method thereof | Chien-Fan Chen | 2024-01-23 |