Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183724 | Multiple pixel package structure with buried chip and electronic device using the same | Tsung-Kang Ying, ERH-CHAN HSU | 2024-12-31 |
| 12009459 | Light-emitting device, light-emitting assembly, and integrated circuit flip-chip | Min Chen | 2024-06-11 |
| 11959606 | Package structure with supporting frame | CHENG-YING LEE, Ming-Sung Tsai | 2024-04-16 |