Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183724 | Multiple pixel package structure with buried chip and electronic device using the same | Chen-Hsiu Lin, ERH-CHAN HSU | 2024-12-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183724 | Multiple pixel package structure with buried chip and electronic device using the same | Chen-Hsiu Lin, ERH-CHAN HSU | 2024-12-31 |