Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12075566 | Bonding pad structure | Yu-Ting Liu, Yeong-E Chen | 2024-08-27 |
| 11860481 | Electronic devices having multiple alignment layers | Jen-Hai Chi | 2024-01-02 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12075566 | Bonding pad structure | Yu-Ting Liu, Yeong-E Chen | 2024-08-27 |
| 11860481 | Electronic devices having multiple alignment layers | Jen-Hai Chi | 2024-01-02 |