Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166003 | RF amplifier devices including top side contacts and methods of manufacturing | Marvin Marbell, Scott Sheppard, Kwangmo Chris Lim, Alexander Komposch, Qianli Mu | 2024-12-10 |
| 12125806 | Electronic device packages with internal moisture barriers | Arthur Fong-Yuen Pun | 2024-10-22 |
| 12113490 | Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias | Marvin Marbell, Qianli Mu, Kwangmo Chris Lim, Michael E. Watts, Mario M. Bokatius +1 more | 2024-10-08 |
| 12034419 | RF amplifiers having shielded transmission line structures | Kwangmo Chris Lim, Qianli Mu, Marvin Marbell, Scott Sheppard, Alexander Komposch | 2024-07-09 |
| 11936342 | Output-integrated transistor amplifier device packages incorporating internal connections | Marvin Marbell, Jonathan Chang, Haedong Jang, Qianli Mu, Michael Lefevre +1 more | 2024-03-19 |
| 11881464 | Stacked RF circuit topology using transistor die with through silicon carbide vias on gate and/or drain | Marvin Marbell, Kwangmo Chris Lim, Qianli Mu | 2024-01-23 |
| 11863130 | Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias | Marvin Marbell, Qianli Mu, Kwangmo Chris Lim, Michael E. Watts, Mario M. Bokatius +1 more | 2024-01-02 |