Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12057433 | EM and RF mitigation silicon structures in stacked die microprocessors for die to platform and die-die RF noise suppression | Amit Jain | 2024-08-06 | $17,070,000 |