Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › EM and RF mitigation silicon structures in stacked die microprocessors for die to platform and die-die RF noise suppression

EM and RF mitigation silicon structures in stacked die microprocessors for die to platform and die-die RF noise suppression

US Patent 12057433 · Granted Aug 6, 2024

Estimated economic value: $17,070,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Platform voltage regulator circuitry configurations2025
Using computer model to determine availability of service option for delivery of2025
Electronic device customization based on environmental and location data2025
Systems and methods for reconciling variants in sequence data relative to refere2025
Providing secure data-replication between a master node and tenant nodes of a mu2025
User equipment (UE) centric position techniques in 5G new radio with multiple ba2025
Methods and systems for enhancement of positioning related protocols2025
Methods for saturation correction and dynamic gain configuration and apparatuses2025
2D floorplan pipeline and refinement2025
Implementing confidence metrics in vehicle-to-everything (V2X) communications2025
Positioning enhancements for narrowband mobile devices2025
Systems comprising a composite backing and methods for long term transdermal adm2024