Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068296 | Method for wafer bonding and compound semiconductor wafer | Marco Haubold, Kerstin Kaemmer, Norbert Thyssen | 2024-08-20 |
SH
Stefan Hampl
Overall (2024): #260,260 of 561,600Top 50%
1
Patents 2024