Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154921 | Image sensor and device for an image sensor | Ines Uhlig, Dirk Offenberg, Norbert Thyssen | 2024-11-26 |
| 12068296 | Method for wafer bonding and compound semiconductor wafer | Stefan Hampl, Marco Haubold, Norbert Thyssen | 2024-08-20 |