Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136952 | Co-packaged integrated optoelectronic module and co-packaged optoelectronic switch chip | ChunFu WU, Chung-Hsin Fu, QianBing YAN, LinChun LI, Chih-Wei Yu +2 more | 2024-11-05 |
| 12092882 | Optical electrical connector with improved heat dissipation performance | Yi-Tseng Lin, Chih-Wei Yu, Chien-Tzu WU, Kuen-Da Jeng | 2024-09-17 |