Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136952 | Co-packaged integrated optoelectronic module and co-packaged optoelectronic switch chip | Min-Sheng Kao, ChunFu WU, Chung-Hsin Fu, QianBing YAN, Chih-Wei Yu +2 more | 2024-11-05 |