Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869850 | Package structure comprising conductive metal board and ground element | CHAO-HSUAN WANG, Po-Sheng Huang | 2024-01-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869850 | Package structure comprising conductive metal board and ground element | CHAO-HSUAN WANG, Po-Sheng Huang | 2024-01-09 |