PH

Po-Sheng Huang

WN Wistron Neweb: 1 patents #14 of 85Top 20%
📍 New Taipei, TW: #607 of 1,741 inventorsTop 35%
Overall (2024): #309,231 of 561,600Top 60%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11869850 Package structure comprising conductive metal board and ground element Lee-Cheng Shen, CHAO-HSUAN WANG 2024-01-09