Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107065 | Uniform chip gaps via injection-molded solder pillars | Eric P. Lewandowski, Dongbing Shao | 2024-10-01 |
| 11990437 | System and method for forming solder bumps | Eric P. Lewandowski, Jeng-Bang Yau, Peter J. Sorce | 2024-05-21 |