Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107065 | Uniform chip gaps via injection-molded solder pillars | Jae-Woong Nah, Dongbing Shao | 2024-10-01 |
| 11990437 | System and method for forming solder bumps | Jae-Woong Nah, Jeng-Bang Yau, Peter J. Sorce | 2024-05-21 |
| 11895932 | Selective chemical frequency modification of Josephson junction resonators | Jeng-Bang Yau, Eric Zhang, Bucknell C. Webb | 2024-02-06 |