Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11884802 | Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same | Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park +1 more | 2024-01-30 |