Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11999841 | Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same | Jin Young Yoon, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong +2 more | 2024-06-04 |
| 11993702 | Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same | Jin Young Yoon, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong +2 more | 2024-05-28 |
| 11905402 | Polyolefin resin composition having high rigidity and low coefficient of linear thermal expansion and weight-reduced automobile part comprising same | Jin Young Yoon, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong +2 more | 2024-02-20 |
| 11884802 | Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same | Jin Young Yoon, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong +1 more | 2024-01-30 |