Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125817 | Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other | Martin Becker, Ronald Eisele, Jacek Rudzki, Frank Osterwald, David Benning | 2024-10-22 |