Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125817 | Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other | André Bastos Abibe, Ronald Eisele, Jacek Rudzki, Frank Osterwald, David Benning | 2024-10-22 |
| 12046576 | Pressure sintering device and method for manufacturing an electronic component | Dirk Dittmann | 2024-07-23 |