Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130470 | PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical components | Nicholas A. Polomoff, Yusheng Bian | 2024-10-29 |
| 11860414 | Edge couplers including a grooved membrane | Tymon Barwicz, Robert K. Leidy | 2024-01-02 |