Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130470 | PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical components | Thomas Houghton, Yusheng Bian | 2024-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130470 | PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical components | Thomas Houghton, Yusheng Bian | 2024-10-29 |