Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12180606 | Plating apparatus | Masaya Seki, Masaki Tomita | 2024-12-31 |
| 12152311 | Wetting method for substrate and plating apparatus | Masaya Seki | 2024-11-26 |
| 12134833 | Plating apparatus and cleaning method of contact member of plating apparatus | Masaya Seki, Masaki Tomita | 2024-11-05 |
| 12116687 | Powder supply apparatus and plating system | Jumpei Fujikata | 2024-10-15 |
| 12077875 | Air bubble removing method of plating apparatus and plating apparatus | Kazuhito Tsuji, Masashi Shimoyama | 2024-09-03 |
| 12054840 | Plating apparatus, pre-wet process method, and cleaning process method | Masaya Seki | 2024-08-06 |
| 11906299 | Plating apparatus and film thickness measuring method for substrate | Masaya Seki, Masaki Tomita | 2024-02-20 |
| 11891715 | Paddle, processing apparatus having the paddle, and method of producing the paddle | Yasuyuki Masuda, Yoshitaka Mukaiyama, Masashi Shimoyama, Jumpei Fujikata | 2024-02-06 |