Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12110386 | Resins for use as tie layer in multilayer structure and multilayer structures comprising the same | Santosh S. Bawiskar, Brian W. Walther, Michael B. Biscoglio, Andong Liu | 2024-10-08 |