Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12110386 | Resins for use as tie layer in multilayer structure and multilayer structures comprising the same | Yong Zheng, Brian W. Walther, Michael B. Biscoglio, Andong Liu | 2024-10-08 |
| 12070876 | Apparatus and method for granulating low viscosity materials | Michael J. Zogg, Jr., Guang Ming Li, Yi Jin, Lonnie Schilhab | 2024-08-27 |
| 11981758 | Process to form a composition containing functionalized and un-functionalized ethylene-based polymers | Brian W. Walther, Jianping Pan | 2024-05-14 |