Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11939450 | Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board | Hirokazu Komori, Masaji Komori, Hideki Kono, Ayane NAKAUE | 2024-03-26 |